As a leading designer of high-performance embedded computing systems, Asis-Pro emphasizes the development of innovative solutions to the frequently underestimated heat removal problem in telecomm, networking, and servers chassis and platforms as well as rack's level. Our Cooling & Power envelope features variable speed fans, control and monitoring logic for optimal cooling.
From high-powered front-to-back cooling for mid - sized chassis with its innovative Sphereflow technology to extremely energy efficient cooling method such as Dynamic Cooling feature, Asis Pro is at the forefront of the cooling technologies to enabled ever-higher power boards to be installed while also extending component life by limiting the maximum temperatures to which the components are exposed.
Asis Pro enables its customers to power their systems by AC or DC sources, from low voltages through HVDC to multiple-KV, single or three phase, ATS, with full control of their operation and monitoring of their status. We provide our partners with a full range of devices from a single Power Distribution Module (PDM) for powering multiple local sense/control point to a fully equipped rack.