To ensure high levels of reliability in embedded computing systems, heat dispersion and removal is a primary consideration since simply, heat kills.  There are several approaches for accomplishing this but fans are by far the most common and more applied method.

Asis Pro development team offers advanced heat control design by tackling all-encompassing challenges from fan system selection to airflow to noise reduction taking into consideration the entire unit’s echo system.

Our system are equipped with optimal cooling and air flow systems, and this acquired knowledge enables our dedicated team design cooling systems that meet our partners most engaging requirements.  From calculating the cooling requirements and airflow to chassis flow impedance to specialized airflow design, as well as fan speed controllers selection, out team design expertise will provide enable you with the optimum solution for your embedded computing products. Using state-of-the-art measurement tools and simulation programs, Asis-Pro team employs design and analysis methodologies to address our partners’ thermal challenges. Remote access, alarms and warnings for temperature and fan failure are a part of our solutions to prevent any heat related damage to your system.

Custom Fan Speed Control

Our diverse line of products include several off the shelf fan speed controllers (AC or DC) with different warning alarms to meet a wide variety of applications. However, to meet our partners challenging requirements, Asis-Pro has successfully produced several custom solutions providing unique fan controllers and alarms products.  A selection of key parameters follows:

  • Idle speed
  • Sensitivity (by means of control slope)
  • Control sensor input (temperature, pressure, humidity and more)
  • Trigger points for warnings and alarms
  • Signal output of alarm
  • Communication – I2C or MODBUS
  • FAN Vibration isolation – per customer requirements

Telecom Equipment Cooling

Cooling sensitive telecom equipment is dependent on regulating the fan speed. two alternatives are available, single or combined:

  • Thermistor – the control is based on temperature
  • Control signal – Pulse Width Modulation (PWM) or DC

The wide variety of fan speed control products encompass a comprehensive specifications range:

  • Supply Voltage of 12 DC to 36-75 dc
  • Up to four fans to any number in parallel (up to 2A)

To obtain an optimum solution for computing embedded enclosures for telecoms application, a fan tray can be custom designed and produced to meet our partner’s most challenging cooling application. These fan trays feature custom packaging, one of its kind circuit board with unique properties such as:

  • Fan supply voltage regulation, “clamping”
  • Fan synchronization
  • EMI filtering
  • Multiple alarm trigger points
  • Provide PWM or VDC control signals to fans with built-in speed control
  • Start-up current transient control
  • In-rush current control

Telecom Equipment Cooling – Implementation in our Products

In order to support for higher performance processor blades that also increase the amount of power, the power/cooling envelope for a payload blade in the original PICMG 3.0 standard defines support for 200W per front payload blade and 50W for the RTM.

With pressurized front-to-back cooling of up to 700W per slot, our MaXum Series system supports any current and future blade cooling requirements. Despite its intensive cooling capabilities, through its Dynamic Cooling feature, the cooling method is extremely energy efficient, delivering the exact amount of necessary cooling for each blade at all times.

It does so by directing the necessary airflow to each blade according to its heat performance.

High-powered front-to-back cooling of horizontal blades for mid-sized ATCA (6/3-slot) chassis is provided in the MaXum Series through its innovative Sphereflow technology. Power and cooling capacities range from 300W up to 700W per blade with both DC and AC power sources and straightforward conversion from one to the other.